Wear is an inevitable issue for mechanical equipment, leading to increased failure rates and reduced service life. Copper (Cu) and its alloys exhibit high electrical and thermal conductivities; however, the insufficient hardness and poor wear resistance limit their application in electronic and electrical engineering. To address the incompatibility between electrical conductivity and tribological properties in Cu materials, dual-scale TiB 2 ceramic particles were used to reinforce Cu matrix composites, which were fabricated via spark plasma sintering. The effect of TiB 2 content on the microstructure, hardness, electrical conductivity, and wear resistance of the TiB 2/Cu composites was investigated. The results indicated that the TiB 2 ceramic particles were well dispersed within the Cu matrix. The hardness of the composites was significantly improved without a substantial reduction in electrical conductivity. Additionally, the compressive strength and wear resistance of the Cu-based composites were enhanced by the addition of dual-scale TiB 2 ceramics. The wear resistance of the composite with 15 wt.% TiB 2 was 3.06 times higher than that of the composite with 5 wt.% TiB 2 under an applied load of 20 N. The dominant wear mechanisms of the composites were adhesive wear, oxidation wear, and abrasive wear.